Photolithographic Process

The principle of photolithographic process is to cover the surface of a silicon wafer with a layer of highly photosensitive photoresist, and then light (usually ULTRAVIOLET light, deep ultraviolet light, extreme ultraviolet light) shines on the surface of the silicon wafer through a mask, and the photoresist will react when the light shines on it.
The irradiated and unirradiated resist are then washed away with a specific solvent to achieve the transfer of the circuit diagram from the mask to the wafer. The photolithographic process is extremely strict to control the minimal pollutants, and the metal ion precipitation of the filter product is strictly controlled.
The most corrosion-resistant perfluorinated filter element adopts imported PTFE membrane, PTFE support layer, perfluorinated skeleton through special structure design and made of terminal filtration suitable for photoresist.

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